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PA05A BU252 A2600 Q2006VH3 24C04A CSDA1BA TRONIC 68HC90
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 Advance Technical Information
Standard Power MOSFET
P-Channel Enhancement Mode Avalanche Rated
IXTH 50P10
VDSS ID25
RDS(on)
= -100 V = -50 A = 55 m
Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR PD TJ TJM Tstg TL Md Weight
Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGS = 1 M Continuous Transient TC = 25C TC = 25C, pulse width limited by TJ TC = 25C TC = 25C TC = 25C
Maximum Ratings -100 -100 20 30 -50 -200 -50 30 300 -55 ... +150 150 -55 ... +150 V V V V A A A mJ W C C C C
TO-247 AD
D (TAB)
G = Gate, S = Source,
D = Drain, TAB = Drain
Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Mounting torque
300
Features * International standard package JEDEC TO-247 AD * Low RDS (on) HDMOSTM process
1.13/10 Nm/lb.in. 6 g
* * *
Rugged polysilicon gate cell structure Unclamped Inductive Switching (UIS) rated Low package inductance (<5 nH) - easy to drive and to protect
Symbol
Test Conditions
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. -100 -3.0 -5.0 100 TJ = 25C TJ = 125C -25 -1 55 V V nA A mA m
VDSS VGS(th) IGSS IDSS RDS(on)
V GS = 0 V, ID = -250 A V DS = VGS, ID = -250 A V GS = 20 VDC, VDS = 0 V DS = 0.8 VDSS V GS = 0 V V GS = -10 V, ID = 0.5 ID25
* * * *
Applications High side switching Push-pull amplifiers DC choppers Automatic test equipment
Advantages * Easy to mount with 1 screw (isolated mounting screw hole) * Space savings
*
High power density
(c) 2002 IXYS All rights reserved
98905 (2/02)
IXTH 50P10
Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 8 16 4200 V GS = 0 V, VDS = -25 V, f = 1 MHz 1720 750 46 V GS = -10 V, VDS = 0.5 VDSS, ID = 0.5 ID25 RG = 4.7 (External) 39 86 38 150 V GS = -10 V, VDS = 0.5 VDSS, ID = 0.5 ID25 36 70 0.42 0.25 S pF pF pF ns ns ns ns nC nC nC K/W K/W
Terminals: 1 - Gate 3 - Source 2 - Drain Tab - Drain
1 2 3
TO-247 AD Outline
gfs Ciss Coss Crss td(on) tr td(off) tf Qg(on) Qgs Qgd RthJC RthCS
V DS = -10 V; ID = ID25, pulse test
Dim.
Source-Drain Diode Symbol IS ISM VSD t rr Test Conditions V GS = 0
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. -50 -200 -3 180 A A V ns
Millimeter Min. Max. A 4.7 5.3 2.2 2.54 A1 A2 2.2 2.6 b 1.0 1.4 b1 1.65 2.13 b2 2.87 3.12 C .4 .8 D 20.80 21.46 E 15.75 16.26 e 5.20 5.72 L 19.81 20.32 L1 4.50 P 3.55 3.65 Q 5.89 6.40 R 4.32 5.49 S 6.15 BSC
Inches Min. Max. .185 .209 .087 .102 .059 .098 .040 .055 .065 .084 .113 .123 .016 .031 .819 .845 .610 .640 0.205 0.225 .780 .800 .177 .140 .144 0.232 0.252 .170 .216 242 BSC
Repetitive; pulse width limited by TJM IF = IS, VGS = 0 V, Pulse test, t 300 s, duty cycle d 2 % IF = IS, di/dt = 100 A/s, VR = -50 V
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,850,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,486,715 5,381,025 6,306,728B1


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